Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With reflector – opaque mask – or optical element integral...
Reexamination Certificate
2007-02-23
2010-10-19
Mandala, Victor A (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Incoherent light emitter structure
With reflector, opaque mask, or optical element integral...
C257S099000, C257SE33058, C257SE33061, C257SE33067, C257SE33073
Reexamination Certificate
active
07816697
ABSTRACT:
A packaging structure and method are provided for packaging an optoelectronic device. Generally, the packaging structure includes: (i) an integrated circuit (IC) package to which the optoelectronic device is affixed; (ii) an optical plug mounted to the IC package, the optical plug positioned relative to the optoelectronic device to direct light to or from the optoelectronic device, the optical plug having an interior optical surface closest to the optoelectronic device that does not make physical contact with either the optoelectronic device or the IC package. Preferably, the packaging structure can further include air or an index matching fluid in a gap between the interior optical surface and the optoelectronic device or IC package. More preferably, both the IC package and the optical plug include features to facilitate alignment and mounting of the optical plug to the IC package during assembly. Other embodiments are also disclosed.
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Huber Edward D.
Spurlock Brett A.
Trisnadi Jahja I.
Cypress Semiconductor Corporation
Mandala Victor A
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