System and method for mounting a heat sink

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S719000, C257S718000, C257S727000

Reexamination Certificate

active

06944023

ABSTRACT:
The invention provides a heat sink assembly having a positionable heat sink permitting the heat sink to be mounted to a substrate in more than one configuration. Various features are described for permitting multiple degrees of freedom in the arrangement of the heat sink assembly. Such features permit the heat sink assembly to be adapted to different environments. The heat sink assembly also has features such as a vane for directing air flow relative to the heat sink. Features for varying and maintaining pressure between the heat sink and a component to be cooled are also included.

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