System and method for locating solder bumps on semiconductor chi

Details System and method for locating solder bumps on semiconductor chi System and method for locating solder bumps on semiconductor chi

1997-01-06

1997-12-02

Bost, Dwayne

Image analysis

Applications

Manufacturing or product inspection

348 87, 382145, G06K 900

Patent

active

056944829

ABSTRACT:
An automated vision system for identifying patterns, such as the solder bump patterns or leads of electronic components. The system is capable of correctly identifying the deviations of an imaged pattern from the nominal location of a reference pattern even if the imaged features are displaced more than half the minimum distance between any two adjacent features of the reference pattern. Further, the system is not limited to identifying patterns that have been merely translated relative to the reference pattern, but can be used if the imaged pattern has been rotated more than 45.degree. relative to the reference pattern depending on the symmetry of the pattern.

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patent: 4628464 (1986-12-01), McConnell
patent: 4944021 (1990-07-01), Hoshino et al.
patent: 4980971 (1991-01-01), Bartschat et al.
patent: 5113565 (1992-05-01), Cipolla et al.
patent: 5461417 (1995-10-01), White At Al.

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