Photocopying – Projection printing and copying cameras – Step and repeat
Patent
1992-09-30
1994-03-01
Wintercorn, Richard A.
Photocopying
Projection printing and copying cameras
Step and repeat
G03B 2742
Patent
active
052912396
ABSTRACT:
A leveling system (10 and 50) with adjustable light beams (38, 53, 55, 59 and 61) is provided for photolithography processes used in manufacturing integrated circuits. The beams (38, 53, 55, 59 and 61) used to assist with positioning wafer (12) relative to the projection camera lens (90) of the step and repeat camera (92) are adjusted for the exposure field (22 and 70) and the desired chip size. For large beam systems (10), the beam width is modified to match the exposure field (22) dimensions which correspond to the desired chip dimensions. For multiple beam systems (50), the geometric relationship of the beams (53, 55, 57, 59 and 61) relative to each other and the desired exposure field (70) are adjusted to provide optimum leveling of the wafer (12) with respect to the projection camera lens (90).
REFERENCES:
patent: 4704020 (1987-11-01), Murakami et al.
patent: 4770531 (1988-09-01), Tanaka et al.
patent: 4845530 (1989-07-01), Matsukawa
patent: 4862245 (1989-08-01), Pashby et al.
patent: 4982226 (1991-01-01), Takahashi
patent: 4999669 (1991-03-01), Sakamoto et al.
patent: 5101226 (1992-03-01), Beaulieu et al.
Glen Zorpette, "Rethinking X-ray Lithography", IEEE, Jun. 1992, pp. 33-36.
Alec Broers, "Choices for Tomorrow's Chips", New Scientist, Apr. 18, 1992, pp. 23-27.
Wm. C. Ward, "Volume Production of Unique Plastic Surface-Mount Modules ffor the IBM 80-NS 1-Mbit Dram Chip by Area Wire Bond Techniques," 0569-5503/88/0000-0552, IEEE, pp. 552-557.
Donaldson Richard L.
Holland Robby T.
Kesterson James C.
Texas Instruments Incorporated
Wintercorn Richard A.
LandOfFree
System and method for leveling semiconductor wafers does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with System and method for leveling semiconductor wafers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and method for leveling semiconductor wafers will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-581689