System and method for joining non-transparent parts by means...

Details System and method for joining non-transparent parts by means... System and method for joining non-transparent parts by means...

2008-01-22

2011-11-22

Crispino, Richard (Department: 1747)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S379600

Reexamination Certificate

active

08062462

ABSTRACT:
A system and a method for joining non-transparent parts (1, 2) by means of an electromagnetic radiation curable adhesive comprises at least one at least partly transparent element (3) inserted between the parts (1, 2) to be joined together such that electromagnetic radiation beamed into the element (3) initiates curing of a film of adhesive applied to the element (3) and/or to a non-transparent part (1, 2).

REFERENCES:
patent: 6627015 (2003-09-01), Takemoto et al.
patent: 2001/0036149 (2001-11-01), Berg et al.
patent: 2001/0046644 (2001-11-01), Ukachi et al.
patent: 2002/0066528 (2002-06-01), Oxman et al.
patent: 2005/0136210 (2005-06-01), Boettcher
patent: 05210046 (1993-08-01), None
patent: WO 9958355 (1999-11-01), None
Machine Translation of JP 05210046 A (Aug. 20, 1993).

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