System and method for integrated waveguide packaging

Details System and method for integrated waveguide packaging System and method for integrated waveguide packaging

2008-02-14

2011-12-06

Trinh, Hoa B (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For high frequency device

C257S705000, C257SE23010

Reexamination Certificate

active

08072065

ABSTRACT:
A millimeter wave system or package may include at least one printed wiring board (PWB), at least one integrated waveguide interface, and at least one monolithic microwave integrated circuit (MMIC). The package may be assembled in panel form incorporating parallel manufacturing techniques.

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patent: 10-2003-0032019 (2003-09-01), None
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International Preliminary Report on Patentability for Application No. PCT/US2009/033681 dated Aug. 17, 2010.
The International Search Report and Written Opinion issued in corresponding Int'l Application No. PCT/US09/033681 on Aug. 27, 2009.

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