System and method for inhibiting and containing resin...

Details System and method for inhibiting and containing resin... System and method for inhibiting and containing resin...

2007-03-12

2009-10-06

Dang, Phuc T (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S048000, C438S116000, C257S694000, C257S706000

Reexamination Certificate

active

07598119

ABSTRACT:
System and method for preventing resin-based adhesive from contacting a substrate to minimize resin bleed-out and contamination. A preferred embodiment comprises a semiconductor device having a die mounted on a substrate, first and second gold surfaces formed on the substrate, a trench formed between the first and second gold surfaces, resin-based adhesive applied to the first gold surface, and a heat sink bonded to the resin-based adhesive.

REFERENCES:
patent: 6331347 (2001-12-01), Haji
patent: 6627329 (2003-09-01), Shintani
patent: 7053521 (2006-05-01), Baumgartner
patent: 7183657 (2007-02-01), Furtaw et al.
patent: 2005/0006700 (2005-01-01), Cao et al.
patent: 2005/0151272 (2005-07-01), Street et al.
patent: 2006/0060985 (2006-03-01), Furtaw et al.
patent: 2007/0158801 (2007-07-01), Lee et al.

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