System and method for independent air bearing zoning for semicon

Details System and method for independent air bearing zoning for semicon System and method for independent air bearing zoning for semicon

1999-03-24

2000-12-05

Butler, Rodney A.

Abrading

Machine

Rotary tool

451288, B24B 2900, B24B 500

Patent

active

061559156

ABSTRACT:
A polishing assembly for CMP of semiconductors includes an air bearing platen having multiple concentric rings of air holes, with each ring defining an air delivery zone. Each ring includes air source holes alternating with air drain holes. A distribution plate is mated with the platen, and the distribution plate has alternating rings of air supply and air exhaust rings. The air supply rings include air supply apertures that are aligned with the air source holes in the platen, and the air exhaust rings include air exhaust apertures that are aligned with the air drain holes in the platen. With this structure, the air distribution profile of each air delivery zone can be established relatively independently of the profiles of the other zones.

REFERENCES:
patent: 5800248 (1998-09-01), Pant et al.
patent: 5987616 (1999-11-01), Suzuki

Affiliated with

Also associated with

Rating

System and method for independent air bearing zoning for semicon does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System and method for independent air bearing zoning for semicon, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and method for independent air bearing zoning for semicon will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-956281