System and method for improving reliability in a...

Semiconductor device manufacturing: process – Chemical etching – Having liquid and vapor etching steps

Reexamination Certificate

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C438S697000, C438S778000

Reexamination Certificate

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07985687

ABSTRACT:
A method for forming a memory device includes forming a hard mask over a substrate, where the hard mask includes a first mask layer and a second mask layer formed over the first mask layer. The substrate is etched to form a trench. The trench is filled with a field oxide material. The second mask layer is stripped from the memory device using a first etching technique and the first mask layer is stripped from the memory device using a second etching technique, where the second etching technique is different than the first etching technique.

REFERENCES:
patent: 6780708 (2004-08-01), Kinoshita et al.
patent: 7220643 (2007-05-01), Wada et al.
patent: 2002/0134754 (2002-09-01), Kim
patent: 2004/0132292 (2004-07-01), Mariani et al.
patent: 2005/0067101 (2005-03-01), Funabashi
patent: 2005/0176219 (2005-08-01), Kim et al.
patent: 2005/0191764 (2005-09-01), Yates et al.
patent: 2005/0263488 (2005-12-01), Change et al.
patent: 2006/0170029 (2006-08-01), Liu et al.
2002 IEEE International Solid-State Circuits Conference, Session 6, “SRAM and Non-Volatile Memories,” Feb. 4, 2004,6 pages.
2002 IEEE International Solid-State Circuits Conference, 23 pages.

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