System and method for implementing wiring changes in a solderles

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Patent

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Details

174260, 174262, 361785, H05K 100

Patent

active

052986861

ABSTRACT:
Both a system and method is provided for implementing a wiring change with respect to an electrical component detachably connected to a solderless PWB module. The system comprises at least one unused via on the PWB, an insulator used for electrically disconnecting a selected contact pad of the component from a contact pad disposed on the PWB, and a metallic strip mounted on a substrate for electrically connecting the selected component contact pad to the unused via. In one embodiment of the system, the substrate used to support the conductive strip is the compliant, insulative sheet material used in the interface that normally interconnects the pads of the electrical component with the pads of the PWB module. Alternatively, a separate "smart" layer formed from a thin insulative sheet material may be used to support the conductive strip. The "smart" layer has an array of conductive regions disposed through its thickness which maintains the contact between the pads of the PWB and the pads of the electrical component. However, when a change is desired, these conductive areas may be abraded off, and a copper strip connector may be provided on the surface of the "smart" layer between the disconnected component contact pad and an unused via by conventional photo-resist techniques.

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