Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2005-12-05
2008-11-18
Tsai, H. Jey (Department: 2812)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S531000, C257S692000, C257S707000, C257SE21022
Reexamination Certificate
active
07453142
ABSTRACT:
A transformer system includes a package substrate having a surface. A plurality of electrically conductive pads are arranged in spaced apart relationship relative to each other on the substrate surface. A first winding is defined by a first electrically conductive path between a first input and a first output, the first electrically conductive path including at least one wire connected between at least one first pad pair of the electrically conductive pads. At least one electrically conductive pad of each first pad pair is at the substrate surface. A second winding is defined by a second electrically conductive path between a second input and a second output, the second electrically conductive path including at least one wire connected between at least one second pad pair of the electrically conductive pads. At least one electrically conductive pad of each second pad pair is at the substrate surface. The first and second electrically conductive paths are proximal each other to achieve a magnetic field coupling between the first and second windings so as to form a transformer.
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Lee See Taur
Leipold Dirk
Peng Solti
Salzman James Fred
Brady III Wade James
Neerings Ronald O.
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
Tsai H. Jey
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