System and method for identifying solder joint defects

Details System and method for identifying solder joint defects System and method for identifying solder joint defects

2005-01-25

2005-01-25

Barlow, John (Department: 2863)

Data processing: measuring, calibrating, or testing

Measurement system in a specific environment

Mechanical measurement system

C378S058000

Reexamination Certificate

active

06847900

ABSTRACT:
An improved circuit inspection system incorporates an automated measuring technique that accounts for acceptable Z-axis elevation variance across both a printed-circuit device and a mounting surface when making solder-joint pass/fail decisions. The improved solder-joint inspection system applies a near neighbor solder joint diameter error analysis for each solder joint on a printed-circuit device. A near neighbor solder joint diameter error outlier analysis is used to identify solder joint defects with improved accuracy.

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