System and method for hermetically sealing a package

Details System and method for hermetically sealing a package System and method for hermetically sealing a package

2007-10-02

2007-10-02

Brewster, William M. (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S128000, C257SE23095, C257SE23124, C257SE23125

Reexamination Certificate

active

10693213

ABSTRACT:
A method for hermetically sealing a package includes applying a light or energy active resist to a fill port to act as a temporary hermetic seal, patterning the resist, and applying a solder to the fill port, wherein the solder is configured to serve as a hermetic seal.

REFERENCES:
patent: 6303986 (2001-10-01), Shook
patent: 6541314 (2003-04-01), Kobayashi
patent: 6566745 (2003-05-01), Beyne et al.
patent: 6588949 (2003-07-01), Zhou
patent: 2001/0025721 (2001-10-01), Maeda et al.
patent: 2003-168696 (2003-06-01), None

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