System and method for hermetic seal formation

Details System and method for hermetic seal formation System and method for hermetic seal formation

2007-01-30

2007-01-30

Johnson, Jonathan (Department: 1725)

Metal fusion bonding

Process

Preplacing solid filler

C228S033000

Reexamination Certificate

active

10327870

ABSTRACT:
System and method for formation of a hermetic seal with an significantly greater melting temperature than the melting temperature of the solder employed. The hermetic seal is formed from a solder with a low melting point and a metal having a predetermined thickness that corresponds to the solder. The solder and metal combination undergoes reflow for a period of time relative to the solder thickness. The resultant seal has a melting point at a temperature significantly greater than the melting temperature of the solder.

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A.D. Romig, Jr., et al., Solder Mechanics—A State of the Art Assessment, Chapter 2—“Physical Metallurgy of Solder-Substrate Reactions”, 1991, pp. 29-104.

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