System and method for forming solder joints

Details System and method for forming solder joints System and method for forming solder joints

2008-05-06

2008-05-06

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Process

Using high frequency vibratory energy

C228S180220, C228S245000

Reexamination Certificate

active

07367486

ABSTRACT:
Disclosed herein are methods and devices for stimulating soldering of a substrate with a component during a reflow process. In an exemplified embodiment, the method involves placing a substrate/component combination into a reflow oven; directing the substrate/component combination to the heating zone of said reflow oven; and vibrating the substrate/component combination while said substrate/component combination is in said heating zone. The vibrating of the substrate/component combination occurs at a predetermined amplitude and frequency such that formation of a complete solder joint is stimulated without displacing said substrate and said component relative to each other.

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Translation of JP-08181142.

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