System and method for establishing link layer parameters based o

Pulse or digital communications – Transceivers – Modems

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

379 9332, H04L 2910

Patent

active

058526315

ABSTRACT:
A system and method for establishing a link layer connection between a calling modem having a plurality of possible first physical layer modulations and one or more possible link layer connections and an answering modem having a plurality of possible second physical layer modulations and one or more possible link layer connections comprising the steps of establishing a physical layer connection between the calling and the answering modems, wherein the physical layer connection is based on a negotiated physical layer modulation chosen from the first and second physical layer modulations, and establishing link layer connection based upon said negotiated physical layer modulation. The link layer connection includes parameters that are preset to default values based upon the negotiated physical layer connection. Thus, the modems are able to avoid the link layer negotiation, thereby providing a faster and more robust connection.

REFERENCES:
patent: 4905282 (1990-02-01), McGlynn et al.
patent: 4931250 (1990-06-01), Greszczuk
patent: 5317594 (1994-05-01), Goldstein
patent: 5425080 (1995-06-01), Abbie
patent: 5491720 (1996-02-01), Davis et al.
patent: 5710761 (1998-01-01), Scott

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

System and method for establishing link layer parameters based o does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System and method for establishing link layer parameters based o, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and method for establishing link layer parameters based o will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2053566

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.