System and method for enhanced LED thermal conductivity

Details System and method for enhanced LED thermal conductivity System and method for enhanced LED thermal conductivity

2005-07-26

2005-07-26

Jackson, Jerome (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With housing or contact structure

C257S100000, C257S459000, C257S707000, C257S745000

Reexamination Certificate

active

06921927

ABSTRACT:
A light emitting device assembly comprises a light emitting diode (LED) chip, a substrate with two terminals, at least one encapsulation layer, and a thermally conductive adhesive to connect the LED chip and the substrate. The first terminal of the substrate is comprised of a portion with a width at least as wide as the LED chip and a vertical cross-sectional area of at least 30% of the total vertical cross-sectional area of the encapsulated assembly, and a straight element. The enlarged first terminal portion provides more area for heat dissipation and conduction, and along with the thermally conductive adhesive and the encapsulation package, provide enhanced thermal conductivity.

REFERENCES:
patent: 6335548 (2002-01-01), Roberts et al.
patent: 6518600 (2003-02-01), Shaddock
patent: 6521916 (2003-02-01), Roberts et al.
Fiber Optic Components, Light-Emitting Diode (LED), pp. 1-8, retrieved from internet—http://www.fiber-optics.info/articles/LEDs.htm—May 12, 2003.

Affiliated with

Also associated with

Rating

System and method for enhanced LED thermal conductivity does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System and method for enhanced LED thermal conductivity, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and method for enhanced LED thermal conductivity will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3395078