Measuring and testing – Specimen stress or strain – or testing by stress or strain... – By loading of specimen
Patent
1997-09-25
1999-07-20
Noori, Max H.
Measuring and testing
Specimen stress or strain, or testing by stress or strain...
By loading of specimen
73774, G01B 716
Patent
active
059258276
ABSTRACT:
A system for, and method of, empirically determining stress in a molded package and a power module embodying the system or the method. In one embodiment, the system includes: (1) a sensor, having a magnetic core exhibiting a known complex permeability in a control environment, that is embedded within the molded package and therefore subject to the stress and (2) a measurement circuit, coupled to the sensor, that applies a drive signal to the sensor, measures a response signal received from the sensor and uses the drive signal and the response signal to determine a complex permeability under stress of the core. The magnitude of the stress can then be determined from the core's complex permeability under stress.
REFERENCES:
patent: 3184963 (1965-05-01), Dahle
patent: 4890084 (1989-12-01), Chu
patent: 4920806 (1990-05-01), Obama et al.
patent: 4931729 (1990-06-01), Pratt
patent: 5086651 (1992-02-01), Westermo et al.
patent: 5142227 (1992-08-01), Fish
patent: 5297439 (1994-03-01), Tyren et al.
patent: 5502381 (1996-03-01), Saitou
U.S. Patent Application entitled "Encapsulated Package for Power Magnetic Devices and Method of Manufacture Therefor" Authors: A.W. Lotfi, J.D. Weld. K.E. Wolf and W.L. Woods: Filed on Feb. 21, 1996: U.S. Serial No. 08/604,637.
Lotfi Ashraf W.
Weld John D.
Lucent Technologies - Inc.
Noori Max H.
LandOfFree
System and method for empirically determining shrinkage stresses does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with System and method for empirically determining shrinkage stresses, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and method for empirically determining shrinkage stresses will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1323359