System and method for electrically interconnecting boards

Details System and method for electrically interconnecting boards System and method for electrically interconnecting boards

2006-07-11

2006-07-11

Le, Thanh-Tam (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

C439S487000

Reexamination Certificate

active

07074051

ABSTRACT:
A system comprising a first board for electrical communication with a second board, at least one electrical communication connector positioned on one side of said first board, and slots constructed in said first board, said slots adapted for allowing at least one electrical communication connector positioned on said second board to mate through said slots with said first board electrical communication connector.

REFERENCES:
patent: 5091826 (1992-02-01), Arnett et al.
patent: 5781414 (1998-07-01), Mills et al.
patent: 5822197 (1998-10-01), Thuault
patent: 6011319 (2000-01-01), Kelly et al.
patent: 6203331 (2001-03-01), McHugh et al.
patent: 6238221 (2001-05-01), Ikeda et al.
patent: 6290514 (2001-09-01), McHugh et al.
patent: 6296495 (2001-10-01), Wang et al.
patent: 6343017 (2002-01-01), Yu et al.
patent: 6409522 (2002-06-01), Onizuka
patent: 6585527 (2003-07-01), Koopman et al.
patent: 6616461 (2003-09-01), Bellinghausen et al.
patent: 6619965 (2003-09-01), Kihira et al.
patent: 6781838 (2004-08-01), Shinotou
patent: 6781845 (2004-08-01), Chang
patent: 2002/0106915 (2002-08-01), Bellinghausen et al.

Affiliated with

Also associated with

Rating

System and method for electrically interconnecting boards does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System and method for electrically interconnecting boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and method for electrically interconnecting boards will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3604678