System and method for electric dewatering of solids suspension

Details System and method for electric dewatering of solids suspension System and method for electric dewatering of solids suspension

1976-06-17

1978-08-15

Prescott, Arthur C.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

204152, 204180R, 204299R, 210406, 210416R, B01D 1302

Patent

active

041070267

ABSTRACT:
A system and method for dewatering of a suspension of solids in an electric field controllably maintained between a pair of opposing self-contained electrode structures, to cause the solids to migrate relative to the carrier liquid to form a layer or cake on the respective self-contained electrode structure, while allowing carrier liquid to be withdrawn under vacuum in the opposite direction through the liquid - pervious wall of a hollow self-contained counter electrode structure, combined with means for controlling the rate of filtrate liquid withdrawal consistent and compatible with the relative speed of migration of the solids in the carrier liquid, and wherein said layer or cake material may be detached from said electrode structure, for instance during exposure from the suspension.

REFERENCES:
patent: 1435886 (1922-11-01), Acton et al.
patent: 2900320 (1959-08-01), Metcalfe et al.
patent: 2944952 (1960-07-01), McMinn, Jr.
patent: 3642605 (1972-02-01), Chenel et al.
patent: 3679565 (1972-07-01), Gilchrist
patent: 3972799 (1976-08-01), Taylor et al.
patent: 3980547 (1976-09-01), Kunkle
patent: 4048038 (1977-09-01), Kunkle

Affiliated with

Also associated with

Rating

System and method for electric dewatering of solids suspension does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System and method for electric dewatering of solids suspension, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and method for electric dewatering of solids suspension will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1432887