System and method for effective yield loss analysis for...

Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C700S110000, C702S084000

Reexamination Certificate

active

06947806

ABSTRACT:
This invention relates to a method for yield loss analysis of process steps of semiconductor wafers having a plurality of dies, and more particularly relates to a defect inspection technique to determine a hit ratio, computation of yield impact contributions for the defects, and determination of a kill ratio for a specific type of defect. Yield loss is estimated ultimately upon a choice of a defect density distribution function. A defect calibrated factor and a yield impact calibrated factor are introduced herein.

REFERENCES:
patent: 6367040 (2002-04-01), Ott et al.
patent: 6496958 (2002-12-01), Ott et al.
patent: 6613590 (2003-09-01), Simmons
patent: 6717431 (2004-04-01), Rathei et al.
patent: 2002/0002415 (2002-01-01), Mugibayashi et al.
Patterson, O.D., Hansen, M.H., “The impact of tolerance on kill ratio estimation for memory”, Advanced Semiconductor Manufacturing Conference and Workshop, 2000 IEEE/SEMI , Sep. 12-14, 2000, pp.: 175-180.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

System and method for effective yield loss analysis for... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System and method for effective yield loss analysis for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and method for effective yield loss analysis for... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3406938

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.