Abrading – Precision device or process - or with condition responsive... – Computer controlled
Reexamination Certificate
2009-01-09
2010-12-07
Eley, Timothy V (Department: 3724)
Abrading
Precision device or process - or with condition responsive...
Computer controlled
C451S010000, C451S021000, C451S056000, C451S072000, C451S443000
Reexamination Certificate
active
07846007
ABSTRACT:
A system for polishing a semiconductor wafer. The system includes a polishing apparatus having a rotatable polishing pad for polishing the wafer. A dressing apparatus is mounted adjacent the polishing pad for dressing the polishing pad. The dressing apparatus includes a dressing member engageable with the polishing pad. A cleaning apparatus is mounted adjacent the polishing pad for removing particulate and chemicals from the polishing pad. The system includes a controller for controlling the dressing apparatus and the cleaning apparatus.
REFERENCES:
patent: 5664987 (1997-09-01), Renteln
patent: 5690544 (1997-11-01), Sakurai
patent: 5961377 (1999-10-01), Jeong
patent: 6113462 (2000-09-01), Yang
patent: 6302762 (2001-10-01), Inaba et al.
patent: 6309277 (2001-10-01), Arcayan et al.
patent: 6371836 (2002-04-01), Brown et al.
patent: 6607423 (2003-08-01), Arcyan et al.
patent: 6875086 (2005-04-01), Golzarian et al.
patent: 6896583 (2005-05-01), Rodriquez et al.
patent: 6910947 (2005-06-01), Paik
patent: 6939208 (2005-09-01), Kamimura et al.
patent: 6976907 (2005-12-01), Golzarian et al.
patent: 7033253 (2006-04-01), Dunn
patent: 2003/0190873 (2003-10-01), Wang et al.
patent: 2004/0023602 (2004-02-01), Moloney et al.
patent: 2005/0164613 (2005-07-01), Seike et al.
Bovio Ezio
Buese Dennis
Corsi Emanuele
Esayanur Madhavan S.
Flannery Larry
Armstrong Teasdale LLP
Eley Timothy V
MEMC Electronic Materials , Inc.
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