Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1998-05-19
2000-08-22
Aftergut, Jeff H
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
118 44, 118 56, 156 87, 1562757, 1562755, 156578, 369286, 369287, G03B 1718
Patent
active
061066575
ABSTRACT:
A system and method dispense resin between substrates. A top substrate device holds a top substrate concave up. A bottom substrate device holds a bottom substrate concave down. A resin dispensing device has a needle and dispenses a trajectory of resin defined by an arc having a tangent that touches a tangent of a concave-up-shaped top substrate. The top substrate device may be arranged to include a dampening mechanism to cause a dampened release of the top substrate. Moreover, the top substrate device may be arranged to hold a top substrate so that the top substrate has a continuous concave-up shape extending from a center portion of the top substrate to its outer diameter, and the bottom substrate device may be arranged to hold a bottom substrate so that the bottom substrate has a continuous concave-down shape extending from a center portion of the bottom substrate to its outer diameter.
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LeBlanc, III Arthur R.
Paulus Joseph W.
Ramanathan Elangovan
Rossignol Brian C.
Aftergut Jeff H
First Light Technology Inc.
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