System and method for direct bonding of substrates

Details System and method for direct bonding of substrates System and method for direct bonding of substrates

2008-07-21

2010-06-22

Richards, N Drew (Department: 2895)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including contaminant removal or mitigation

C257S682000, C257S777000, C257S085000, C257S621000, C257S774000

Reexamination Certificate

active

07741157

ABSTRACT:
A method of forming a MEMS (Micro-Electro-Mechanical System), includes forming an ambient port through a MEMS cap which defines a cavity containing a plurality of MEMS actuators therein; and bonding a lid arrangement to the MEMS cap to hermetically seal the ambient port.

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