Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2006-08-08
2006-08-08
Sells, James (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C438S455000
Reexamination Certificate
active
07087134
ABSTRACT:
A method of bonding substrates and devices having bonded substrates are disclosed. The method of bonding substrates includes depositing a layer of bonding substrate material onto a bonding surface of a first substrate. A bonding site density of at least one of the layer of bonding substrate material or a bonding surface of a second substrate is increased, and the bonding surface of the first substrate having the layer of bonding substrate material is bonded to the bonding surface of the second substrate.
REFERENCES:
patent: 5421953 (1995-06-01), Nagakubo et al.
patent: 5427638 (1995-06-01), Goetz et al.
patent: 5503704 (1996-04-01), Bower et al.
patent: 6093577 (2000-07-01), van der Groen et al.
patent: 6180496 (2001-01-01), Farrens et al.
patent: 6316322 (2001-11-01), Hao
patent: 6316332 (2001-11-01), Lo et al.
patent: 6455398 (2002-09-01), Fonstad, Jr. et al.
patent: 6469909 (2002-10-01), Simmons
patent: 6553651 (2003-04-01), Reznik et al.
patent: 6555904 (2003-04-01), Karpman
patent: 6559530 (2003-05-01), Hinzel et al.
patent: 6617040 (2003-09-01), Houser et al.
patent: 6660614 (2003-12-01), Hirschfeld et al.
patent: 6780759 (2004-08-01), Farrens et al.
patent: 6902987 (2005-06-01), Tong et al.
patent: 2004/0058476 (2004-03-01), Enquist et al.
Hiller, et al., Subproject C4: “Microelectronic compatible scanner arrays of high frequency,” pp. 37-39. www.infotech.tu-chemnitz.de/ microtec/eng/press/annualrep02/pdf/subproject—c4.pdf.
Martin A Schmidt, “Wafer-to-Wafer Bonding for Microstructure Formation”, Proc. of the IEEE, V. 86 (8), Aug. 1998, pp. 1575-1585.
T. Suni et al, “Effects of Plasma Activation on Hydrophilic Bonding of Si and SiO2”, Jrnl of the Electrochemical Society, V 149(6), pp. G348-G351.
Q.Y. Tong et al, “Feasibility Study of VLSI Device Layer Transfer by CMP PETEOS Direct Bonding”, Proc. of the 1996 IEEE Int'l SOI Conference, Oct. 1996.
Chen Chien-Hua
Haluzak Charles C.
Hewlett--Packard Development Company, L.P.
Sells James
LandOfFree
System and method for direct-bonding of substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with System and method for direct-bonding of substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and method for direct-bonding of substrates will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3650870