System and method for detection of spatial signature yield loss

Details System and method for detection of spatial signature yield loss System and method for detection of spatial signature yield loss

2007-05-01

2007-05-01

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

With measuring or testing

C257SE21521

Reexamination Certificate

active

11036672

ABSTRACT:
A method and system are provided for identifying systematic yield losses. The method comprising testing produced products using a test sequence, the testing sequence producing yield data, the yield data related to a wafer. For each zone of each wafer size calculating and storing a first data series R1, wherein each element of said first series is the yield of a said zone. Further calculating and storing for each element of R1 a second data series R2, wherein each element of the second series is a p consecutive element moving average of R1. Calculating and storing for each element of R1 a third data series R3 wherein each element of the third data series a p consecutive element moving standard deviation of data series R1. Calculating for each element of R1 a trigger point, wherein the trigger point is calculated as the respective R2 element less an adjusted respective R3 value. A notification is triggered when the trigger point calculated for each element of R1 is greater than the respective element of R1.

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