System and method for detection of spatial signature yield loss

Details System and method for detection of spatial signature yield loss System and method for detection of spatial signature yield loss

2008-07-15

2008-07-15

Lebentritt, Michael S. (Department: 2812)

Optics: measuring and testing

Inspection of flaws or impurities

Surface condition

Reexamination Certificate

active

07400391

ABSTRACT:
A system for identifying systematic yield losses comprises a device configured to test produced products using a test sequence that produces yield data related to a wafer. The wafer is divided into multiple zones. Series of yield data may be collected and stored for each zone. A first data series R1is the yield of a zone; a second data series R2is a p consecutive element moving average of data series R1; and a third data series R3is a p consecutive element moving standard deviation of data series R1. A device is configured to calculate a trigger point for each element of R1, wherein the trigger point is calculated as the respective R2element less an adjusted respective R3value. A notification may be provided to a user when the trigger point calculated for each element of R1is greater than the respective element of R1.

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