System and method for design and fabrication of a high...

Details System and method for design and fabrication of a high... System and method for design and fabrication of a high...

2007-07-17

2008-11-18

Kuntz, Curtis (Department: 2614)

Electrical audio signal processing systems and devices

Electro-acoustic audio transducer

C029S594000, C029S025350, C310S800000, C310S366000, C427S100000

Reexamination Certificate

active

07454024

ABSTRACT:
Techniques for fabricating high frequency ultrasound transducers are provided herein. In one embodiment, the fabrication includes depositing a copperclad polyimide film, a layer of epoxy on the copperclad polyimide film, and a polyvinylidene fluoride film on the epoxy. The assembly of materials are then pressed to bond the polyvinylidene fluoride film to the copperclad polyimide film and to form an assembly. The polyvinylidene fluoride film being one surface and the copperclad polyimide film being the other surface. The area behind the copperclad polyimide film surface is filled with a second epoxy, and then cured to form an epoxy plug.

REFERENCES:
patent: 5166573 (1992-11-01), Brown
patent: 6784600 (2004-08-01), Klee et al.

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