System and method for decreasing stress on solder holding...

Details System and method for decreasing stress on solder holding... System and method for decreasing stress on solder holding...

2005-10-06

2009-02-17

Menz, Douglas M (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Outside periphery of package having specified shape or...

C257S678000, C257S669000

Reexamination Certificate

active

07492044

ABSTRACT:
Mechanical stress on solder joints that hold BGA modules to computer motherboards is reduced by adding to the motherboard a topmost layer, and forming V-shaped channels into the layer next to the BGA module so that stress is shielded from the BGA module and its solder joints.

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“Motherboard”. Oxford English Dictionary Online. Draft Revision Dec. 2002. Mar. 13, 2007. Keyword: motherboard. http://dictionary.oed.com/cgi/entry/00316365?single=1&query—type=word&word&queryword=mother−board&first=1&max—to—show=10.

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