Cutting – Processes – With subsequent handling
Patent
1998-11-13
2000-04-25
Rada, Rinaldi I.
Cutting
Processes
With subsequent handling
83155, 83364, 834686, 839291, 83420, 83421, 83435, 83425, 83732, 83446, 83449, 83492, 83503, 83507, 83676, 29846, H05K 302
Patent
active
060530847
ABSTRACT:
This invention relates to a system and method for cutting circuit board panels utilizing an in-line cutting mechanism. As the panel is transported into the cutting mechanism, adjustable rails are moved into position to properly guide the panel into the cutting head. The actual cutting operation is performed by transporting the panel between an upper cutting disk blade and a lower cutting disk blade. The distance between these two blades is adjustable and permits precision cutting of the panel with minimal stress to the circuit board and its components.
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Ashley Boyer
Lucent Technologies - Inc.
Onka Thomas J.
Rada Rinaldi I.
Woodridge Richard C.
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