Refrigeration – Structural installation – With electrical component cooling
Reexamination Certificate
2005-11-29
2005-11-29
Norman, Marc (Department: 3744)
Refrigeration
Structural installation
With electrical component cooling
C713S322000, C713S340000
Reexamination Certificate
active
06968709
ABSTRACT:
A method and system of cooling hardware, sensing hardware, and supporting code streams that enables a non-redundant liquid cooling system to be used seemlessly in conjunction with an air cooling backup solution. The result offers system speed and reliability benefits of liquid cooling except for the brief occasions when the primary cooling system has failed and air cooling takes over. Until the liquid cooling is repaired, system clocks are automatically slowed to be compatible with the circuit speeds possible at the higher temperatures associated with air cooling. When the liquid cooling is repaired, the system clocks are automatically returned to their normal fast state. Depending on the circuit technology used, a supplied voltage may be varied while being air cooled.
REFERENCES:
patent: 5159529 (1992-10-01), Lovgren et al.
patent: 5239200 (1993-08-01), Messina et al.
patent: 5253484 (1993-10-01), Corman et al.
patent: 5285347 (1994-02-01), Fox et al.
patent: 5752011 (1998-05-01), Thomas et al.
patent: 6058012 (2000-05-01), Cooper et al.
patent: 6135200 (2000-10-01), Okochi et al.
patent: 6252771 (2001-06-01), Jordan
patent: 6275945 (2001-08-01), Tsuji et al.
patent: 6305463 (2001-10-01), Salmonson
patent: 6362960 (2002-03-01), Ducourt et al.
patent: 6415388 (2002-07-01), Browning et al.
patent: 6535798 (2003-03-01), Bhatia et al.
patent: 2002/0075644 (2002-06-01), Nakagawa et al.
patent: 2003/0074591 (2003-04-01), McClendon et al.
patent: 2005/0030171 (2005-02-01), Liu et al.
Goth Gary F.
Kearney Daniel J.
Low Kevin P.
Meyer Udo H. G.
Swaney Scott B.
Cantor & Colburn LLP
Kinnaman, Jr. William A.
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