System and method for cooling an electronic component

Details System and method for cooling an electronic component System and method for cooling an electronic component

2007-01-24

2009-06-23

Chervinsky, Boris L (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S701000, C361S702000, C361S716000, C361S721000, C165S080400, C165S104330

Reexamination Certificate

active

07551440

ABSTRACT:
A cooling system has at least one heat conducting element in thermal contact with an electronic component. A heat exchanger is in fluid communication with the heat conducting element. The heat exchanger is configured to provide a working fluid to the at least one heat conducting element to facilitate dissipation of heat from the respective electronic component. The heat exchanger has a form factor dimensioned and configured for mounting in a preconfigured hardware unit slot of a computer chassis.

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