System and method for cooling a thermally loaded device on...

Details System and method for cooling a thermally loaded device on... System and method for cooling a thermally loaded device on...

2007-12-14

2010-06-08

Tapolcai, William E (Department: 3744)

Refrigeration

Processes

Circulating external gas

C062S244000, C062S401000, C244S05300R

Reexamination Certificate

active

07730728

ABSTRACT:
A system (10) for cooling a thermally loaded device on board an aircraft comprises a distribution line (12) which is in communication with an installation space (14) of the thermally loaded device, a coolant supply line (20) which is in communication with a coolant source, and a heat removal line (28) which is in communication with a source of pressure below atmospheric pressure. A shut-off control device (34) is adapted so as, in a first position, to separate the distribution line (12) from the coolant supply line (20) and connect the distribution line (12) to the heat removal line (28) and, in a second position, to connect the distribution line (12) to the coolant supply line (20) and separate the distribution line (12) from the heat removal line (28).

REFERENCES:
patent: 3752422 (1973-08-01), Runnels et al.
patent: RE32100 (1986-04-01), Rannenberg
patent: 5491979 (1996-02-01), Kull et al.
patent: 6127758 (2000-10-01), Murry et al.
patent: 6460353 (2002-10-01), Udobot et al.
patent: 7069731 (2006-07-01), Hunt
patent: 7305842 (2007-12-01), Schiff
patent: 7334423 (2008-02-01), Bruno et al.
patent: 2005/0126517 (2005-06-01), Piccirilli et al.
patent: 1695910 (2006-08-01), None
patent: 2166542 (1986-05-01), None

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