System and method for controlling wafer temperature

Optics: measuring and testing – By light interference – For dimensional measurement

Reexamination Certificate

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Reexamination Certificate

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07612890

ABSTRACT:
The invention is directed to a system and method for implementing process control for temperature of a semiconductor wafer using sonic NDE techniques. The system may, for example, generate ultrasound waves in a test object during the manufacturing process. A detector such as an interferometer may be used to detect the ultrasound waves. An interpreter or analyzer may determine the temperature of the semiconductor wafer from the waves. Then, a control system may determine and implement an appropriate control action on the process.

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