System and method for controlling semiconductor wafer processing

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364468, 364552, 364151, G05B 1304

Patent

active

055262937

ABSTRACT:
A system (10) for run-to-run control of semiconductor wafer processing is provided. An input/output device (12) receives a desired quality characteristic for a particular semiconductor fabrication process. A generating circuit (22) uses a model to generate appropriate process parameters for a processing unit (20) and an expected quality characteristic. An adjusting circuit (16) functions to adjust process parameter inputs of the processing unit (20). In-situ sensor (18) functions to measure a quality characteristic of the process in the processing unit (20) on a real-time basis. A comparing circuit (24) functions to compare the measured quality characteristic with the expected quality characteristic. A model adjusting circuit (26) may adjust the model of the generating circuit (22) if the measured quality characteristic varies from the expected quality characteristic by more than a predetermined statistical amount.

REFERENCES:
patent: 5347460 (1994-09-01), Gifford et al.
B. J. Mandel. The Regression Control Chart. Journal of Quality Technology, 1(1):pp. 1-9, Jan. 1969.
B. Bombay and C. J. Spanos. Application of Adaptive Equipment Models to a Photolithographic Process. In SPIE Proceedings: Process Module Metrology, Control and Clustering, vol. 1594, pp. 277-284, California, Sep. 1991.
Costas J. Spanos, Hai-Fang Guo, and Joanne Levine-Parril. Real-Time Statistical Process Control Using Tool Data. IEEE Transactions on Semiconductor Manufacturing pp. 308-318, Nov. 1992.
K. K. Lin and C. J. Spanos, Statistical Equipment Modeling for VLSI Manfacturing: An Application for LPCVD. IEEE Transactions on Semiconductor Manfacturing, 3(4):216-229, Nov. 1991.

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