Wave transmission lines and networks – Coupling networks – With impedance matching
Reexamination Certificate
2008-07-15
2008-07-15
Jones, Stephen E (Department: 2817)
Wave transmission lines and networks
Coupling networks
With impedance matching
C257S692000, C257S698000, C257S737000
Reexamination Certificate
active
11137296
ABSTRACT:
Systems and methods for improved semiconductor device performance are disclosed. In particular, presented are improved semiconductor systems and methods for configuring conductors to reduce impedance variation caused by proximity and/or density and/or operation of connection-bumps. The invention includes adding impedance-reducing conductive features which add no additional functionality to the semiconductor device. The added features may be arranged in areas of sparse connection-bump density. Impedance-reducing conductive features may include metal lines added between functional metal lines, where placement between adjacent functional lines may vary. Impedance-reducing conductive features may be added to any one or combination of conductive layers, and added features may act upon any one or combination of functional features. Further, added features may be electrically active and responsive to semiconductor device operation. Also, methods for determining connection-bump density, which methods may be automated.
REFERENCES:
patent: 5523622 (1996-06-01), Harada et al.
patent: 08-306696 (1996-11-01), None
patent: 2002-280453 (2002-09-01), None
patent: 2003-152081 (2003-05-01), None
Jones Stephen E
Kabushiki Kaisha Toshiba
Sprinkle IP Law Group
LandOfFree
System and method for configuring conductors within an... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with System and method for configuring conductors within an..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and method for configuring conductors within an... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3925730