System and method for cleaning chemistry and processing...

Cleaning and liquid contact with solids – Processes – Using solid work treating agents

Reexamination Certificate

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Details

C134S034000, C134S036000, C134S042000, C134S902000, C510S175000, C510S434000, C510S461000, C510S477000

Reexamination Certificate

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07374621

ABSTRACT:
A solution of ammonium citrate and benzotriazole (BTA) is used to clean thin film magnetic head wafers. When used with brushing, the solution is a highly efficient process for removing particles, such as those generated during chemical-mechanical polishing (CMP), without causing corrosion and roughness. This process may be used on all CMP layers in thin film magnetic head wafer fabrication.

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Yi-Koan Hong, Dae-Hong Eom, & Jin-Goo Park, “Effect of Additives in Post Cu CMP Cleaning Solutions on Particle Adhesion and Removal”, Metallurgy and Materials Engineering, Hanyang University, Ansan, Korea, Oct. 13, 2003, from http://user.chollian.net/˜jhonny/ecs2003.pdf, 26 pages.

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