Cleaning and liquid contact with solids – Processes – Using solid work treating agents
Reexamination Certificate
2008-05-20
2008-05-20
Carrillo, Sharidan (Department: 1792)
Cleaning and liquid contact with solids
Processes
Using solid work treating agents
C134S034000, C134S036000, C134S042000, C134S902000, C510S175000, C510S434000, C510S461000, C510S477000
Reexamination Certificate
active
07374621
ABSTRACT:
A solution of ammonium citrate and benzotriazole (BTA) is used to clean thin film magnetic head wafers. When used with brushing, the solution is a highly efficient process for removing particles, such as those generated during chemical-mechanical polishing (CMP), without causing corrosion and roughness. This process may be used on all CMP layers in thin film magnetic head wafer fabrication.
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Yi-Koan Hong, Dae-Hong Eom, & Jin-Goo Park, “Effect of Additives in Post Cu CMP Cleaning Solutions on Particle Adhesion and Removal”, Metallurgy and Materials Engineering, Hanyang University, Ansan, Korea, Oct. 13, 2003, from http://user.chollian.net/˜jhonny/ecs2003.pdf, 26 pages.
Guthrie Hung-Chin
Jiang Ming
Lara Nick
Yang John Jaekoyun
Bracewell & Giuliani LLP
Carrillo Sharidan
Hitachi Global Storage Technologies Netherlands BV
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