System and method for characterizing three-dimensional...

Optics: measuring and testing – By particle light scattering – With photocell detection

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C356S636000

Reexamination Certificate

active

06867862

ABSTRACT:
A metrology system for characterizing three-dimensional structures and methods for manufacturing and using same. The metrology system includes a measurement system that preferably comprises an energy source and energy detector and that is in communication with a processing system. Under control of the processing system, the metrology system rotates the measurement system relative to a structure while the energy source directs a beam of incident energy toward the structure. The incident energy rebounds from the structure as scattered energy, at least a portion of which propagates toward the energy detector. Due to the relative rotation, the energy detector receives scattered energy from the structure at a plurality of angles, and the measurement system produces data signals therefrom, which data signals are provided to the processing system. The processing system analyzes the data signals to determine whether the structure has any defects, such as yield limiting deviations or other processing defects.

REFERENCES:
patent: 4999014 (1991-03-01), Gold et al.
patent: 5042951 (1991-08-01), Gold et al.
patent: 5181080 (1993-01-01), Fanton et al.
patent: 5329357 (1994-07-01), Bernoux et al.
patent: 5412473 (1995-05-01), Rosencwaig et al.
patent: 5596411 (1997-01-01), Fanton et al.
patent: 5604344 (1997-02-01), Finarov et al.
patent: 5608526 (1997-03-01), Piwonka-Corle et al.
patent: 5747813 (1998-05-01), Norton et al.
patent: 5771094 (1998-06-01), Carter et al.
patent: 5867276 (1999-02-01), McNeil et al.
patent: 6115117 (2000-09-01), Isozaki
patent: 6124924 (2000-09-01), Feldman et al.
patent: 6323946 (2001-11-01), Norton
patent: 6429943 (2002-08-01), Opsal et al.
patent: 6433878 (2002-08-01), Niu et al.
patent: 6451621 (2002-09-01), Rangarajan et al.
patent: 6483580 (2002-11-01), Xu et al.
patent: 6556303 (2003-04-01), Rangarajan et al.
patent: 6583731 (2003-06-01), Chan et al.
patent: 6608686 (2003-08-01), Lane et al.
patent: 6608690 (2003-08-01), Niu et al.
patent: 6633831 (2003-10-01), Nikoonahad et al.
patent: 6636843 (2003-10-01), Doddi et al.
patent: 6645824 (2003-11-01), Yang et al.
patent: 6665071 (2003-12-01), Hovinen et al.
patent: 6689519 (2004-02-01), Brown et al.
patent: 6694275 (2004-02-01), Jakadar et al.
patent: 6694284 (2004-02-01), Nikoonahad et al.
patent: 6704661 (2004-03-01), Opsal et al.
patent: 6721052 (2004-04-01), Zhao et al.
patent: 20020051564 (2002-05-01), Benesch et al.
patent: 20020101585 (2002-08-01), Benesch et al.
patent: 20030206298 (2003-11-01), Bischoff et al.
patent: 20040017574 (2004-01-01), Vuong et al.
patent: 20040070772 (2004-04-01), Shchegrov et al.
Logofatu, Petre C., “UV Scatterometry,” Proceedings of SPIE: Metrology, Inspection, and Process Control for Microlithography XVII, May 2003, pp. 208-214, vol. 5038, The International Society for Optical Engineering (SPIE), Bellingham, Washington, USA.
Hettwer, Andrea et al., “Phi-Scatterometry for Integrated Linewidth and Process Control in DRAM Manufacturing,” IEEE Transactions on Semiconductor Manufacturing, Nov. 2002, pp. 470-477, vol. 15, No. 4, Institute of Electrical and Electronics Engineers (IEEE), New York, New York, USA.
Niu, Xinhui et al., “Specular Spectroscopic Scatterometry,” IEEE Transactions on Semiconductor Manufacturing, May 2001, pp. 97-111, vol. 14, No. 2, Institute of Electrical and Electronics Engineers (IEEE), New York, New York, USA.
Schneider, Claus et al., “Integrated metrology: An enabler for advanced process control (APC),” Proceedings of SPIE: In-Line Characterization, Yield, Reliability, and Failure Analysis in Microelectronic Manufacturing II, Apr. 2001, pp. 118-130, vol. 4406, The International Society for Optical Engineering (SPIE), Bellingham, Washington, USA.
Benesch, Norbert et al., “Phi-Scatterometry for Integrated Linewidth Control in DRAM Manufacturing,” 2001 IEEE International Symposium on Semiconductor Manufacturing, Oct. 8-10, 2001, pp. 129-132, IEEE Catalog No. 01CH37203, San Jose, California, USA.
Coulombe, Stephen A. et al., “Scatterometry measurement of sub-0.1 μm linewidth gratings,” Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Jan., 1998, pp. 80-87, vol. 16, Issue 1, American Vacuum Society, Research Triangle Park, North Carolina, USA.
Raymond, Christopher J. et al., “Multiparameter grating metrology using optical scatterometry,” Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Mar., 1997, pp. 361-368, vol. 15, Issue 2, American Vacuum Society, Research Triangle Park, North Carolina, USA.
Giovannini, H. et al., “Angle-resolved polarimetric phase measurement for the characterization of gratings,” Optics Letters, Oct. 15, 1996, pp. 1619-1621, vol. 21, No. 20, Optical Society of America, Washington, DC, USA.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

System and method for characterizing three-dimensional... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System and method for characterizing three-dimensional..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and method for characterizing three-dimensional... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3398175

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.