System and method for capacitive coupled via structures in...

Details System and method for capacitive coupled via structures in... System and method for capacitive coupled via structures in...

2007-12-11

2007-12-11

Norris, Jeremy C (Department: 2841)

Metal working

Method of mechanical manufacture

Electrical device making

C029S854000

Reexamination Certificate

active

10924629

ABSTRACT:
Power supplied to an information handling system electronic component through a circuit board has component package inductance parasitic effects compensated by configuring connections to the electronic component to have increased parasitic capacitance. For instance, power and ground vias that connect a processor to power and ground planes of the circuit board are aligned to create a desired parasitic capacitance that reduces the impact of parasitic inductance relating to signal compensation, power delivery and high speed decoupling. The desired distributed capacitance is modeled by altering the radius associated with the equivalent line charge of the power via, the distance associated with the line charges between power and ground vias, and the via barrel length.

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