System and method for applying a liquid

Cleaning and liquid contact with solids – Processes – With treating fluid motion

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Details

134 24, 134 42, 134169R, 134171, 134175, B08B 300

Patent

active

052521370

ABSTRACT:
A liquid applying system according to the present invention comprises a liquid supply source and a nozzle communicating with the liquid supply source. The nozzle comprises a liquid storing portion for storing a liquid supplied from the liquid supply source, a number of small passages communicating with the liquid storing portion, each of the small passages having a transverse section which is smaller than that of the liquid storing portion, and a slit-like passage communicating with the small passages, in which liquids from the small passages flow together and from which the liquids are continuously discharged like a curtain toward a semiconductor wafer.

REFERENCES:
patent: 4579597 (1986-04-01), Sasa et al.
patent: 5002008 (1991-03-01), Ushijima et al.
patent: 5009715 (1991-04-01), Wilson
patent: 5013530 (1991-05-01), McGregor

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