System and method for analog replication of microdevices...

Details System and method for analog replication of microdevices... System and method for analog replication of microdevices...

2005-04-05

2005-04-05

Chen, Kin-Chan (Department: 1765)

Semiconductor device manufacturing: process

Chemical etching

C438S725000, C216S044000

Reexamination Certificate

active

06875695

ABSTRACT:
A master wafer is replicated by creating a mold by plating a nickel electroform on a surface of a silicon wafer. Thereafter, a child wafer is prepared with a layer of photoresist or similar material that is compatible with plasma-etching techniques. Thereafter, the mold shape is transferred to the photoresist through compression molding, thereafter the child wafer is etched.

REFERENCES:
patent: 4845310 (1989-07-01), Postupack
patent: 5310623 (1994-05-01), Gal
patent: 5512131 (1996-04-01), Kumar et al.
patent: 5575878 (1996-11-01), Cox et al.
patent: 5772905 (1998-06-01), Chou
patent: 6027595 (2000-02-01), Suleski
patent: 6277666 (2001-08-01), Hays et al.
patent: 6288998 (2001-09-01), Taira
patent: 6309580 (2001-10-01), Chou
patent: 6410213 (2002-06-01), Raguin et al.
patent: 6586327 (2003-07-01), Shepard

Affiliated with

Also associated with

Rating

System and method for analog replication of microdevices... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System and method for analog replication of microdevices..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and method for analog replication of microdevices... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3427085