System and method for achieving planar alignment of a...

Details System and method for achieving planar alignment of a... System and method for achieving planar alignment of a...

2006-09-05

2006-09-05

Edmondson, Lynne R. (Department: 1725)

Metal fusion bonding

Including means to apply flux or filler to work or applicator

Moving work

C228S033000, C228S041000, C228S049500, C228S246000

Reexamination Certificate

active

07100813

ABSTRACT:
A system (10) and method (30) for precisely depositing a solder compound onto a substrate (18). The system (10) generally includes a receiving member (20) having a rotatable portion (21) adapted to receive a planar substrate (18), a horizontal member (12) for depositing solder balls (11) on the substrate (18), and a contact member (14), located between the receiving member (20) and horizontal member (12). The contact member comprises an aligner plate (14) having a pair of stoppers (15) protruding therefrom. Advantageously, pivotable portion (21) of the system (10) establishes the planarity of the substrate (18), with respect to the horizontal mount (12) allowing for the solder balls (11) to be mounted thereon, preventing the substrate (18) from being slightly misaligned, warped, and/or tilted.

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