Coating processes – Solid particles or fibers applied
Patent
1992-03-04
1993-03-16
Beck, Shrive
Coating processes
Solid particles or fibers applied
118308, 118689, 118691, 118712, 427424, B05D 112
Patent
active
051942976
ABSTRACT:
A particle deposition system having an atomizer, wafer transport, sheath flow means, particle counter and computer control for accurately depositing a desired density of particles onto a surface. The sheath flow keeps an article clean, while the particle flux in the deposition chamber is rising from zero to an equilibrium state. The particle counter measures particle flux by sampling the atmosphere in the deposition chamber. The computer determines when the rate of change of particle flux is substantially zero and then actuates transport of the article completely or partially out of the sheath flow into the mist of falling particles. The computer also calculates the required deposition time for providing the article's surface with a desired particle density, actuating transport of the article back into the sheath flow after the desired density is reached. The operator of the system can specify particle size, desired density and full or partial coverage of the surface with particles. The particles can be polystyrene latex reference spheres or real contaminant types for use in calibration wafers for surface scanners.
REFERENCES:
patent: 4477187 (1984-10-01), Pettit et al.
B. R. Locke et al., "Particle Sizing Uncertainties in Laser Scanning of Silicon Wafers", Journal Electrochemical Society, Jul. 1987, vol. 134, No. 7, pp. 1763-1771.
Konicek Paul A.
Scheer Bradley W.
Beck Shrive
Owens Terry J.
VLSI Standards, Inc.
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