System and apparatus for distributing flush fluid to processing

Details System and apparatus for distributing flush fluid to processing System and apparatus for distributing flush fluid to processing

1998-04-06

2000-08-15

Eley, Timothy V.

Abrading

Machine

Combined

451 36, 451 99, 451446, B24B 700

Patent

active

061027820

ABSTRACT:
An apparatus is provided with a wafer polishing tool, a source of slurry, and a source of low pressure de-ionized water. The slurry is supplied to the tool for chemical-mechanical planarization. Periodically, the slurry source is shut off and the de-ionized water is used to flush the apparatus. The desired safe low pressure of the de-ionized water may be maintained by opposed one-way check valves. The flushing system prevents the slurry from clogging or becoming stagnant, and prevents valves and pumps within the apparatus from malfunctioning. Moreover, the low pressure de-ionized water will not contaminate the higher pressure slurry even in the event of a system malfunction.

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