System and a method for fluid filling wafer level packages

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S127000, C257S787000

Reexamination Certificate

active

06858466

ABSTRACT:
A fluid filling system includes a vacuum filling chamber configured to receive a wafer, a conduit coupled to the vacuum filling chamber, and a vacuum pump fluidly coupled to the vacuum filling chamber through the conduit, the vacuum pump being configured to create a vacuum within the wafer level packaging cavity, wherein the vacuum filling chamber includes a body having a vacuum orifice, a first substrate sealingly coupled to the body to seal a first end of the vacuum orifice, and a second substrate sealingly coupled to the body to seal a second end of the vacuum orifice.

REFERENCES:
patent: 6218215 (2001-04-01), Distefano et al.
patent: 6611314 (2003-08-01), Choi et al.
patent: 6621157 (2003-09-01), Herbst et al.
patent: 6659116 (2003-12-01), Williams et al.
patent: 6788477 (2004-09-01), Lin
patent: 20020094260 (2002-07-01), Coomer et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

System and a method for fluid filling wafer level packages does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System and a method for fluid filling wafer level packages, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and a method for fluid filling wafer level packages will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3448446

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.