System and a method for fluid filling wafer level packages

Details System and a method for fluid filling wafer level packages System and a method for fluid filling wafer level packages

2005-02-22

2005-02-22

Thai, Luan (Department: 2829)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S127000, C257S787000

Reexamination Certificate

active

06858466

ABSTRACT:
A fluid filling system includes a vacuum filling chamber configured to receive a wafer, a conduit coupled to the vacuum filling chamber, and a vacuum pump fluidly coupled to the vacuum filling chamber through the conduit, the vacuum pump being configured to create a vacuum within the wafer level packaging cavity, wherein the vacuum filling chamber includes a body having a vacuum orifice, a first substrate sealingly coupled to the body to seal a first end of the vacuum orifice, and a second substrate sealingly coupled to the body to seal a second end of the vacuum orifice.

REFERENCES:
patent: 6218215 (2001-04-01), Distefano et al.
patent: 6611314 (2003-08-01), Choi et al.
patent: 6621157 (2003-09-01), Herbst et al.
patent: 6659116 (2003-12-01), Williams et al.
patent: 6788477 (2004-09-01), Lin
patent: 20020094260 (2002-07-01), Coomer et al.

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