Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2005-02-22
2005-02-22
Thai, Luan (Department: 2829)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S127000, C257S787000
Reexamination Certificate
active
06858466
ABSTRACT:
A fluid filling system includes a vacuum filling chamber configured to receive a wafer, a conduit coupled to the vacuum filling chamber, and a vacuum pump fluidly coupled to the vacuum filling chamber through the conduit, the vacuum pump being configured to create a vacuum within the wafer level packaging cavity, wherein the vacuum filling chamber includes a body having a vacuum orifice, a first substrate sealingly coupled to the body to seal a first end of the vacuum orifice, and a second substrate sealingly coupled to the body to seal a second end of the vacuum orifice.
REFERENCES:
patent: 6218215 (2001-04-01), Distefano et al.
patent: 6611314 (2003-08-01), Choi et al.
patent: 6621157 (2003-09-01), Herbst et al.
patent: 6659116 (2003-12-01), Williams et al.
patent: 6788477 (2004-09-01), Lin
patent: 20020094260 (2002-07-01), Coomer et al.
Bower Bradley
Qi Quan
Sand Kirby
Hewlett--Packard Development Company, L.P.
Thai Luan
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