System and a method for controlling flow of solder

Details System and a method for controlling flow of solder System and a method for controlling flow of solder

2011-04-05

2011-04-05

Patel, Ishwarbhai B (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S260000

Reexamination Certificate

active

07919714

ABSTRACT:
An assembly including a solder wettable surface is provided. The assembly also includes a metal mask configured to restrict solder from flowing outside the solder wettable surface.

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