Synthetic resin composition, substrate material for printed circ

Details Synthetic resin composition, substrate material for printed circ Synthetic resin composition, substrate material for printed circ

1987-06-22

1989-10-24

Pertilla, Theodore E.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

427 96, 4284251, 4284253, 428901, C08F28304, C08L 6100

Patent

active

048763195

ABSTRACT:
The invention relates to a synthetic resin composition comprising a phenol-formaldehyde resin and a polyurethane component, and to a substrate material for printed circuit boards, comprising a fibrous carrier material which is impregnated with such a synthetic resin composition derived from the reaction of a phenol and a formaldehyde-producing compound in the presence of the polyurethane component and a basic catalyst to form an interpolymer which upon further processing yields a substrate material which is on the one hand suitable to be provided with holes by punching and piercing and on the other is not subject to an objectionable degree of sagging during the soldering of components onto the printed circuit board by means of a wavesoldering bath.

REFERENCES:
patent: 4173594 (1979-11-01), Dyszlewski
patent: 4440833 (1984-04-01), Franz et al.

Affiliated with

Also associated with

Rating

Synthetic resin composition, substrate material for printed circ does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Synthetic resin composition, substrate material for printed circ, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Synthetic resin composition, substrate material for printed circ will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1589872