Synchronous tape head polishing device and method

Details Synchronous tape head polishing device and method Synchronous tape head polishing device and method

2006-02-21

2006-02-21

Wilson, Lee D. (Department: 3723)

Abrading

Abrading process

C451S005000, C451S041000, C451S168000, C451S170000, C451S305000

Reexamination Certificate

active

07001250

ABSTRACT:
In the tape head polishing method of the present invention the tape head is moved orthogonally to the polishing medium (such as diamond polishing tape) direction of motion during polishing. The polishing medium motion is synchronized with the tape head motion, such that the polishing medium is held stationary when the tape head motion is stationary, and the polishing medium is moved when the tape head motion is approximately at a maximum velocity. The tape head velocity VHand the polishing medium velocity VTduring the tape motion are generally related by the equation VT≦VHTan φ, where Tan φ=W/L, where W is the width of an insulation layer fabricated between a magnetic shield and a tape head read sensor element, and L is the length of a read sensor element.

REFERENCES:
patent: 5475553 (1995-12-01), Saliba
patent: 5735036 (1998-04-01), Barr et al.
patent: 5885131 (1999-03-01), Azarian et al.
patent: 5913716 (1999-06-01), Mucci et al.
patent: 6004189 (1999-12-01), Phillips
patent: 6179689 (2001-01-01), Ohno et al.
patent: 6447374 (2002-09-01), Sommer et al.
patent: 6497611 (2002-12-01), Sakurada et al.

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