Wave transmission lines and networks – Coupling networks – With impedance matching
Patent
1977-09-09
1978-04-18
Gensler, Paul L.
Wave transmission lines and networks
Coupling networks
With impedance matching
333 31R, 333 84M, H01P 308, H01P 508
Patent
active
040853900
ABSTRACT:
A microwave stripline package provides symmetrical ground currents while permitting discrete components such as diodes, terminations, capacitors, etc.to be used. The package comprises a pair of face-to-face printed circuit boards, each of which is formed of a dielectric having a ground plane on one surface. The discrete components together with a printed circuit are assembled on one of the boards while a portion of the dielectric of the other board is cut away to provide mechanical clearance for the circuit components. Matching portions of the dielectrics on either side of the printed circuit are cut away to receive a pair of metal blocks which contact both the upper and lower ground planes in order to form a screened enclosure. The dimensions of the printed circuit within the screened enclosure are selected to provide impedance matching with the stripline outside the enclosure.
REFERENCES:
patent: 3135935 (1974-06-01), Engelbrecht
patent: 3868594 (1975-02-01), Cornwell et al.
Gonda, Transmission Line Couplers, IBM Tech. Discl. Bulletin, vol. 4, No. 12, May 1962.
Bland et al., Coax to Stripline Transition, IBM Tech. Discl. Bulletin, vol. 3, No. 4. Sept. 1960.
Communications Satellite Corporation
Gensler Paul L.
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