Swithing regulator utilizing seperate integrated circuits...

Electricity: power supply or regulation systems – In shunt with source or load – Using a three or more terminal semiconductive device

Reexamination Certificate

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Details

C323S284000

Reexamination Certificate

active

06674268

ABSTRACT:

TECHNICAL FIELD
The invention relates to a switching FET circuit and to a method of operation of such a circuit, for example for use in a synchronous dc-dc voltage converter.
BACKGROUND AND SUMMARY OF THE INVENTION
Circuits involving switching FETs are known. Examples include direct current (dc) to dc converters which are generally used to convert from one dc voltage level to another, for example to provide a 1.5V voltage rail from a 12V voltage supply.
One type of converter, a synchronous dc-dc converter, is illustrated schematically in FIG.
1
. input voltage V
in
is applied between input terminals
2
,
4
. A pair of transistors, here field effect transistors
6
,
8
, are connected between the input terminals
2
,
4
. The transistor
6
adjacent to the input terminal
4
is known as the control FET or high side transistor, and the transistor
8
adjacent to the ground is know as the synchronous (sync) FET or low side transistor. The high side is relatively more positive than the low side, though it is not necessary that either the high or the low side has any particular relationship to ground.
The node between the transistors
6
,
8
is known as the switch node
10
. The switch node feeds through an inductor
12
and across a capacitor
14
to an output
16
.
The control and sync FETs are driven by respective drivers
30
,
32
.
A control circuit
18
has one input on an input control terminal
20
and another input fed from the output
16
via a feedback path
22
. The control circuit
18
supplies control signals to control the FETs
6
,
8
to maintain a constant voltage at the output by switching transistors
6
,
8
off and on alternately. The control signals are alternating signals which cause the control and sync FETs to conduct alternately. The mark-space ratio is varied, i.e. the ratio of the time for which the control FET conducts to the time the sync FET conducts is modulated, to achieve the desired voltage on the output
16
.
Examples of such dc-dc converters include those presented in WO98/49607 to Intel Corporation and U.S. Pat. No. 5,479,089 to Lee.
One feature of synchronous dc-dc converters is that it is not generally desired to switch on both high and low side transistors
6
,
8
simultaneously. If both transistors are on, the input voltage is short-circuited by current passing directly between the two input terminals
2
,
4
through the control and sync FETs. The phenomenon known as “shoot-through”. Accordingly, the control circuit
18
is generally arranged to ensure that only one of the two transistors
6
,
8
is on at a time.
This is conventionally carried out by monitoring two voltages. The voltage at the switch node
10
is monitored to prevent the switching on of the low side transistor
8
until the high side transistor
6
is switched off. The voltage at the gate
24
of the low side transistor
8
is monitored to prevent the high side transistor switching on until the low side transistor
8
is switched off. WO98/49607 describes a circuit of this type, as does U.S. Pat. No. 5,479,089 to Lee.
The dead time when neither FET is conducting depends on the transistor threshold voltage and the capacitance of the sync FET, which vary widely due to manufacturing spread of parameters of the chosen FET, as well as according to the individual choice of FET. This means that a control IC has to use conservative estimates of these parameters to produce a dead time that will avoid shoot through. This is generally a longer dead time than would be possible if the control circuit were optimised for the specific FETs used.
The present trend is to increase switching and clock speeds, which increases the significance of the dead time during which neither high or low side transistor
6
,
8
is on. It would be beneficial to reduce this time.
A further disadvantage occurs in the case that a plurality of FETs in parallel are used in place of the single high and low side transistors. The parallel FETs never switch at exactly the same time due to different gate resistances and other parameters caused again by manufacturing variations or variability in the circuit in which the FETs are provided. Thus, it becomes difficult to correctly determine when all of the high side or low side FETs are switched off and accordingly when the other FETs can be switched on. The solution generally adopted is to include a gate resistor in the circuit, but this slows down the switching of the FETs and increases switching losses, especially at high frequencies. Accordingly, it would be beneficial to provide a circuit arrangement that could more easily use parallel FETs.
According to the invention there is provided a switching circuit for switching an input dc voltage of predetermined polarity applied to input voltage terminals, comprising a high side package and a low side package each having a logic input and a switch connected between switching outputs, the switching outputs of the high and low side packages being connected in series between the input voltage terminals; a pulse width modulator connected to the logic inputs of the packages for supplying an alternating control signal to the logic inputs for switching the high and low side switches alternately; wherein each of the high and low side packages contains logic circuitry for controlling the respective switch based solely on the voltages on the respective logic input and respective switching outputs to prevent the switches in the high and low side packages from conducting at the same time.
Thus, shoot through is prevented without the need for providing complex circuitry to pass control signals between the high and low side circuits. The only control signal needed is the alternating pulse width modulated (PWM) control signal, which may be at logic levels. Since the driver circuits in the high and low side components are not reliant on signals from the other of the high and low side components the switching can be speeded up and the dead time in which neither of the switches are conducting can be reduced.
The switches may be FETs.
The node connecting the high and low side package is known as the switch node. The logic circuitry in each of the packages may include a sense circuit that controls the switching of the corresponding switch based on the voltage at the switch node and the voltage input.
In preferred embodiments, the sense circuits include an edge detector for detecting a voltage edge of opposite polarity to the predetermined polarity and for switching on the corresponding FET only after the voltage edge is detected.
Alternatively, the logic circuits may implement a delay after the control signal alternates before switching on the corresponding FET.
The driver circuit may be isolated from the control circuit and the low voltage side of the driver circuit may be directly connected to the source of the corresponding FET. In this way the area of the circuit that drives the gate can be minimised, which minimises the gate-source loop inductance, contributing to faster rise and fall times of the gate-source voltage. Further, any parasitic inductance in the source connection does not cause a reduction in the gate-source voltage with consequent slower switching at turn-on of the FET.
The drivers may be directly connected to the gates of the corresponding FETs without the need for a resistor between driver and gate. Such a resistor may be needed in prior designs in which switching on of the control FET is triggered by monitoring the gate voltage of the sync FET.
The high and low side components can readily be arranged in parallel, since each includes its own circuitry for avoiding shoot through.
By integrating a driver with each FET in a corresponding package, board space may be reduced and board design simplified. Each FET can now be considered as a device that takes a digital input and automatically controls its gate drive to ensure that it conducts at the appropriate time to prevent shoot-through and minimise dead time.
The high side component may include an internal bootstrap diode and be isolated from the control circuit. This perm

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